This application note provides guidelines for the use of Wafer Level Chip Size Packages (WLCSP). The information in this application note can be used throughout the various stages of WLCSP use. This ...

Las Vegas, NV, Jan. 09, 2020 (GLOBE NEWSWIRE) -- Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW) ...

Historically, embedded IC package technology is not new at all: several players such as Freescale with its RCP, Infineon with its eWLB and Ibiden for die embedding into PCB laminated substrates have ...

FREMONT, CA / ACCESS Newswire / November 12, 2025 / Aehr Test Systems (AEHR), a worldwide supplier of semiconductor test and burn-in solutions, today announced the shipment of its Dual-Echo™ test and ...

A fully qualified, high-performance, low-power and small-form-factor wafer-level chip-scale package (W-CSP) developed by Oki Semiconductor satisfies a wide range of ASIC design demands. Targeting chip ...

A look at design considerations for a double-sided RDL, including board-level reliability and the challenges of higher density. System-in-Package (SiP) technology continues to be essential for higher ...

Amkor Technology and Nanium, a Portugal-based IC backend house specializing in wafer-level fan-out (WLFO) packaging solutions, have entered into a definitive agreement for Amkor to... Fujifilm has ...

Considered something of a necessary evil, burn-in of IC packages during production does a great job of weeding out latent defects so they don’t turn into failures in the field. But as AI and ...

Extensive Array of Back-End and Advanced Packaging Wet Wafer Process Equipment Leverages ACM’s Experience to Address Emerging Requirements for Wafer-Level Packaging FREMONT, Calif., Oct. 15, 2020 ...

– WLP Package Footprint Enables Form Factor Suitable for 5G Mobile Device Market – – Qualified WLP Packaging Expected in the Second Half of CY20 – Las Vegas, NV, Jan. 09, 2020 (GLOBE NEWSWIRE) -- ...